File talk:Samsung Galaxy Tab 2 10.1 - Texas Instruments TWL6032-3960.jpg

This file has been used in: Chantelle Dubois (2017-12-18). Possible IC Packaging Shortages in 2018 (in en). allaboutcircuits.com. Retrieved on 2017-12-21. another path, web.archives.org

This file has been used in: Java Joe (2022-08-11). $54B+ for US Semiconductors (in en). lexleader.net. Retrieved on 2022-09-28. web.archives.org

This file has been used in: Veena S. Chakravarthi (2020) "11.6 Packaging Technology" in (in English) A Practical Approach to VLSI System on Chip (SoC) Design, Cham: Springer Nature Switzerland AG, p. 221 Retrieved on 14 December 2022. DOI: 10.1007/978-3-030-23049-4. ISBN: 978-3-030-23048-7. ISBN 978-3-030-23049-4 (eBook)

This file has been used in: Veena S. Chakravarthi (14 December 2022) "11.6 Packaging Technology" in (in English) A Practical Approach to VLSI System on Chip (SoC) Design, Cham: Springer Nature Switzerland AG, p. 221 Retrieved on 14 December 2022. DOI: 10.1007/978-3-031-18363-8_10. ISBN: 978-3-031-18362-1. ISBN 978-3-031-18363-8 (eBook)

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