File:Ceramic-DIP package sideview.PNG
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Ceramic-DIP_package_sideview.PNG (800 × 580 pixels, file size: 46 KB, MIME type: image/png)
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| Description |
English: Ceramic-DIP package sideview |
| Date | |
| Source | Own work (Ref:沼倉研史、E. Jan Vardaman著 『半導体パッケージのできるまで』、日刊工業新聞社、2005年12月12日初版1刷発行、ISBN 4526055581) |
| Author | Tosaka |
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This file is licensed under the Creative Commons Attribution 3.0 Unported license.
- You are free:
- to share – to copy, distribute and transmit the work
- to remix – to adapt the work
- Under the following conditions:
- attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 10:23, 2 July 2009 | | 800 × 580 (46 KB) | Tosaka~commonswiki (talk | contribs) | {{Information |Description={{en|1=Ceramic-DIP package sideview}} |Source=Own work (Ref:沼倉研史、E. Jan Vardaman著 『半導体パッケージのできるまで』、日刊工業新聞社、2005年12月12日初版1刷発行、ISBN 4526055581) |Aut |
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